層號(hào) 層數(shù)描述 疊構(gòu)設(shè)計(jì) 各層厚度及銅厚(mil) er Layer
Solder Mask 0.4 3.5
Layer 1 TOP 1.3 1
Prepreg 8 4.1
Layer 2 GND 0.6 2
Core 3 4.2
Layer 3 PWR 0.6 3
Prepreg 8 4.1
Layer 4 BOT 1.3 4
Solder Mask 0.4 3.5
TOP&BOT 12MIL 50OHM

TOP & BOT 6/4/6MIL 90OHM